Polywell 1U8N16-4189A

1U 8x2.5” NVMe, 16 DIMM 2 OCP 3.0, 2 PCIe 2 M.2, Dual Ice Lake Xeon®

Featured Highlights

• 1U 8 x 2.5” NVMe U.2/ SAS/ SATA Hot Swap Drives
• Dual Socket P+ for 3rd Gen. Intel® Scalable Xeon® Processors
• 16 DDR4 up to 6TB 8-Channel Intel® Optane™ Memory
• 2 PCIe 4.0 x16 Slots
• 2 M.2-2280 M-Key
• 2 PCIe OCP 3.0 PCIe 4.0 x16 Slots for Networking Module, IPMI 2.0
• 860W Platinum Redundant Power Supply
• For Virtual Server, Compute Server, Database Server, Cloud, etc.

CPU options
• Dual 3rd Generation Intel® Scalable Xeon®
• Socket P+ (LGA 4189), supports 270W, Up to 40 Core 80 Threads
Chipset
• Intel® C621A
Memory
• 16 x DDR4 DIMM Sockets
• 8-channel memory bus per processor
• Supports up to 4TB ECC DDR4 3200MHz RDIMM
• Supports up to 6TB Intel® Optane™ Persistent Memory 200 series
Graphics
• Aspeed AST2600 BMC VGA (DB15)
Network
• 2 x OCP 3.0 (PCIe 4.0 x16) for Network Modules
• Network Modules are available with 2-4 ports of 1G/2.5G/10G/25G/100G RJ45/SFP+/SFP28/QSFP28
• RJ45 Gigabit LAN for IPMI 2.0 by AST2600 (KVM)
• Additional LAN or InfiniBand by PCIe add-on cards
Expansion
• 2 x PCIe 4.0 x16 (Full Height Half Length)
• 2 x OCP 3.0 (PCIe 4.0 x16) for Network Modules
Storage
• 8 x 2.5” NVMe U.2 PCIe 4.0 / SATA Hot Swap Bays
• Intel® C621A NVMe (16GT/s) or SATA (6Gb/s) RAID-0/1/5/10
• 2 x M.2-2280 Sockets for NVMe/ SATA RAID-0/1
• 1 x SATA-DOM (Disk on Module)
Audio
Back panel I/O
• 1 x RJ45 IPMI
• 1 x DB15 VGA
• 2 x USB 3.0
• 1 x RS-232 COM
Internal I/O
• 2 x USB 3.0 Headers
• 1 x RS-232 COM Header
• 1 x TPM Header
Other I/O
Function
System BIOS
• AMI®
• Watchdog Supported
Chassis
• 1U Rackmount with Optional DVD-ROM drive bay
• 6 x 4cm Cooling Fans
• Dimension: 1.7" (43 mm) H x 17.2" (437 mm) W x 23.5" (597 mm) D
• System Weight: 25 lbs. (11.3 kg) Net, 40 lbs. (18.1kg) Gross
Power supply
• 860W (1+1) Redundant Platinum Level
• 100-240Vac Input and 200-240Vdc Input
OS support
•Windows Server, Linux, FreeBSD, VMware
Application
•Virtual Server, Compute Server, Database Server, Cloud Computing
Environment
• Operating Temperature: 10 to +35 C
• Non-operating Temperature: -40 to +60 C
• Vibration - Operating: 9.8 m/s2(1.0G) 5 to 500Hz
• Vibration - Non operating: 49 m/s2(5.0G) 15 to 500Hz
• Shock - Operating: 3,920 m/s2 (400G) 2ms
• Shock - Non-Operating: 8,820 m/s2 (900G) 1ms
• Operating Relative Humidity: 8% to 90% (non-condensing)
• Non-operating Relative Humidity: 5% to 95% (non-condensing)
• MTBF: 100,000 Hours
• FCC, CE, UL, RoHS Compliance
• TAA Compliance
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