Polywell 4U10GPU-C741
4U 10 GPU Xeon for AI Computing
Featured Highlights
• 4U 10 Dual-Slot GPU Cards
• Dual Sockets 4th/5th Gen Intel® Xeon® Processor
• Front 8 x 2.5” U.2/SAS/SATA SSD/HD Drive Bays
• Up to 10× FHFL GPU Card (8-card is optimal)
• 32 DDR5 ECC Memory, up to 8TB
• 4×1GbE / 2×10Gb SFP+ / 4×10Gb SFP+/ 2×25Gb SFP28 option
• BMC KVM (IPMI 2.0) Remote Management
• 4 x 2700W 3+1 CRPS Titanium Redundant Power Supply
• Runs Microsoft Windows, Server, Linux OS
• GPU Cluster for AI, Deep Learning, HPC.
CPU options
• Dual Sockets Intel® 4th / 5th Gen Xeon® Sapphire Rapids/ Emerald Rapids, up to 350W
Chipset
• Intel® C741
Memory
• 32× DDR5 slots (RDIMM)，16-channel (8-channel per CPU), up to 5600MHz, support RDIMM/3DS RDIMM
• Up to 8TB ECC
• Up to 8TB ECC
Graphics
• 1×VGA
Network
• Support 1×OCP3.0 expansion slot standard with PCIe 5.0 x8, (x16 is option)
• LAN options: 4×1GbE / 2×10Gb SFP+ / 4×10Gb SFP+/ 2×25Gb SFP28
• Support NCSI
• LAN options: 4×1GbE / 2×10Gb SFP+ / 4×10Gb SFP+/ 2×25Gb SFP28
• Support NCSI
Expansion
• Up to 15× standard expansion slots
• Up to 10× FHFL GPU Card (8-card is optimal)
• Support 5×PCIe5.0 ×16 + 2×PCIe4.0 ×8 (inaddition to 8 GPU)
• Up to 10× FHFL GPU Card (8-card is optimal)
• Support 5×PCIe5.0 ×16 + 2×PCIe4.0 ×8 (inaddition to 8 GPU)
Storage
• Up to Front 24 x 2.5" SAS/SATA (4 can be for NVMe U.2) or 12× 3.5” SAS/SATA Drives
• 2× M.2-2280/22110 PCIe 4.0 4x NVMe SSD for OS Boot Drives (supports RAID-1 Mirror)
• 2× M.2-2280/22110 PCIe 4.0 4x NVMe SSD for OS Boot Drives (supports RAID-1 Mirror)
Audio
Back panel I/O
• 1×VGA
• 1×COM
• 2×USB3.0
• 1×IPMI RJ45
• 1×Standard OCP NIC 3.0 slot
• 1×COM
• 2×USB3.0
• 1×IPMI RJ45
• 1×Standard OCP NIC 3.0 slot
Internal I/O
• 2× USB 3.0 header、2×USB 2.0 header、1× USB 2.0 Type A
• 1 × VROC Key header
• 3 × MCIO（PCIe 5.0x8），support 6 × NVMe（PCIe 5.0x4）
• 2 × M.2 , PCIe 4.0 x4 , 2280 & 22110
• 1× VGA header for FP
• 1×SPI TPM 2.0
• 1 × VROC Key header
• 3 × MCIO（PCIe 5.0x8），support 6 × NVMe（PCIe 5.0x4）
• 2 × M.2 , PCIe 4.0 x4 , 2280 & 22110
• 1× VGA header for FP
• 1×SPI TPM 2.0
Other I/O
Function
System BIOS
Chassis
4U 19" Standard Rackmount
• 2.5” Configuration: W 448mm × H 175mm × D 772mm （792mm with ear bezel）
• 3.5” Configuration: W 448mm × H 175mm × D 822mm （842mm with ear bezel）
• 2.5” Configuration: W 448mm × H 175mm × D 772mm （792mm with ear bezel）
• 3.5” Configuration: W 448mm × H 175mm × D 822mm （842mm with ear bezel）
Power supply
• 4×Standard CRPS Power Modules，hot-swappable, support 2+2/ 3+1/ 1+1 redundancy
• 1600W/2000W/2400W/2700W Platinum or Titanium power supply module option
• 1600W/2000W/2400W/2700W Platinum or Titanium power supply module option
OS support
Windows Server, Linux
Application
• GPU for AI, Deep Learning, HPC.
Environment
• Operating Temperature: +10 to +35 C
• Non-operating Temperature: -40 to +70 C
• Operating Relative Humidity: 10% to 80% (non-condensing)
• Non-operating Relative Humidity: 10% to 93% (non-condensing)
• MTBF: 100,000 Hours
• FCC, CE, UL, RoHS Compliance
• Non-operating Temperature: -40 to +70 C
• Operating Relative Humidity: 10% to 80% (non-condensing)
• Non-operating Relative Humidity: 10% to 93% (non-condensing)
• MTBF: 100,000 Hours
• FCC, CE, UL, RoHS Compliance