Polywell 4U8GPU-X6
4U 8 GPU 6th Gen Xeon® powered for AI Computing
Featured Highlights
• 4U 8 Dual-Slot GPU Cards
• Dual Sockets 6th Gen Intel® Xeon® Processor
• Front 8 x 2.5” U.2/SAS/SATA SSD/HD Drive Bays
• Up to 8 × FHFL GPU Card
• 32 DDR5 ECC Memory, up to 8TB
• 4×1GbE / 2×10Gb SFP+ / 4×10Gb SFP+/ 2×25Gb SFP28 option
• BMC KVM (IPMI 2.0) Remote Management
• 4 x 2700W 3+1 CRPS Titanium Redundant Power Supply
• Runs Microsoft Windows Server, Linux OS
• GPU Cluster for AI, Deep Learning, HPC.
CPU options
• Dual Intel 6th Gen Xeon® Birch Stream-Sp , up to 144 cores each , max 350W, Support 6700P, 6500P, 6700E series CPU.
Chipset
Memory
• 32 × DDR5 slots (RDIMM)，16-channel (8-channel per CPU), up to 5600MHz, support RDIMM/3DS RDIMM
• Up to 8TB ECC
• Up to 8TB ECC
Graphics
• 1 × VGA
Network
• Support 1×OCP3.0 expansion slot standard with PCIe 5.0 x8, (x16 is option)
• LAN options: 4×1GbE / 2×10Gb SFP+ / 4×10Gb SFP+/ 2×25Gb SFP28
• Support NCSI
• LAN options: 4×1GbE / 2×10Gb SFP+ / 4×10Gb SFP+/ 2×25Gb SFP28
• Support NCSI
Expansion
• Up to 11 × standard expansion slots
• Up to 8 × FHFL GPU Card
• Support 1 × PCIe5.0 ×16 + 2 × PCIe4.0 ×8 (inaddition to 8 GPU)
• Up to 8 × FHFL GPU Card
• Support 1 × PCIe5.0 ×16 + 2 × PCIe4.0 ×8 (inaddition to 8 GPU)
Storage
• Support 8 / 12 × 3.5” or 24 × 2.5” HDDs
• Support 4 × U.2 NVMe SSD, 2 × M.2 PCIe4.0 ×4/SATA SSD，2280/22110
• Support 4 × U.2 NVMe SSD, 2 × M.2 PCIe4.0 ×4/SATA SSD，2280/22110
Audio
Back panel I/O
• 1 × VGA
• 1 × COM
• 2 × USB3.0
• 1 × IPMI RJ45
• 1 × Standard OCP NIC 3.0 slot
• 1 × COM
• 2 × USB3.0
• 1 × IPMI RJ45
• 1 × Standard OCP NIC 3.0 slot
Internal I/O
• 2 × USB 3.0 header、2×USB 2.0 header、1× USB 2.0 Type A
• 3 × MCIO（PCIe 5.0x8），support 6 × NVMe（PCIe 5.0x4）
• 1 × VGA header for FP
• 1 × SPI TPM 2.0
• 3 × MCIO（PCIe 5.0x8），support 6 × NVMe（PCIe 5.0x4）
• 1 × VGA header for FP
• 1 × SPI TPM 2.0
Other I/O
Function
System BIOS
Chassis
• 4U 19" Standard Rackmount
• 2.5” Configuration: W 448mm × H 175mm × D 772mm （792mm with ear bezel）
• 3.5” Configuration: W 448mm × H 175mm × D 822mm （842mm with ear bezel）
• 2.5” Configuration: W 448mm × H 175mm × D 772mm （792mm with ear bezel）
• 3.5” Configuration: W 448mm × H 175mm × D 822mm （842mm with ear bezel）
Power supply
• 4×Standard CRPS Power Modules，hot-swappable, support 2+2/ 3+1/ 1+1 redundancy
• 1600W/2000W/2400W/2700W Platinum or Titanium power supply module option
• 1600W/2000W/2400W/2700W Platinum or Titanium power supply module option
OS support
• Windows Server, Linux
Application
• GPU Cluster for AI, Deep Learning, HPC.
Environment
• Operating Temperature: +10 to +35 C
• Non-operating Temperature: -40 to +70 C
• Operating Relative Humidity: 10% to 80% (non-condensing)
• Non-operating Relative Humidity: 10% to 93% (non-condensing)
• MTBF: 100,000 Hours
• FCC, CE, UL, RoHS Compliance
• Non-operating Temperature: -40 to +70 C
• Operating Relative Humidity: 10% to 80% (non-condensing)
• Non-operating Relative Humidity: 10% to 93% (non-condensing)
• MTBF: 100,000 Hours
• FCC, CE, UL, RoHS Compliance