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Polywell H410A1

Slim 10th Gen Socket-S, HDMI+MiniDP+LVDS, 2M.2+COM, Low-Voltage Eco-Smart

Featured Highlights

• Intel® Core™ i9/i7/i5 Processor 1200pin
10th Gen. Comet Lake Platform
Low-voltage energy efficiency Eco-smart computing
• Intel® H410 Express Chipset
• Intel® UHD 630 Graphics,4K/5K Resolution, HDR 10Bit color, HDMI+MiniDP+LVDS
• 2 DDR4 SO-DIMM for up to 32GB Memory
• 2 SATA-6Gb/s, M.2 SSD/NVMe
• Gigabit LAN + M.2 WiFi
• 4 USB 3.0, 4 USB 2.0
• 5.1 ALC662 Audio Sound
• DC12V 60W or higher wattage Power Adapter (UL/CE/FCC Certified)
• OS Support: Windows 10/11, IoT, Linux
• Applications: Set Top Box, Digital Signage, POS/Kiosk, Surveillance, etc.

CPU options
• Intel® 10th Generation Comet Lake Processor
• LGA1200 Socket-S series with 35W, 65W TDP
• Intel® Core™ i9-10900, 10900T 10C/20T 20M Cache
• Intel® Core™ i7-10700, 10700T 8C/16T 16M Cache
• Intel® Core™ i5-10600, 10500, 10400T 6C/12T 12M Cache
• Intel® Core™ i3-10100, 10100T 4C/8T 6M Cache
• Intel® Pentium® Gold G6600, G6400T 2C/4T 4M, Celeron® G5900, G5900T 2C/2T 2M
Chipset
• Intel® H410 Express Chipset
Memory
• 2 x DDR4 SO-DIMM
• 2666/2400/2133MHz unbuffered non-ECC (Dual Channel I/O)
• Supports up to 32GB
Graphics
• Intel® UHD 630 Graphics, 4K/5K Resolution, HDR 10Bit color
• Support 2 Graphics ports, 1 header
• 1 x HDMI, supporting a maximum resolution of 3840x2160 30Hz Support for HDMI 1.4 version and HDCP 2.2
• 1 x MiniDP
• 1 x LVDS header
Network
• 1 x Realtek® RTL8111F Gigabit (10/100/1000 Mb/s) LAN
• 1 x M.2 2230 Socket (Taken by WiFi+BT Module)
• Wake on LAN, PXE boot (Diskless) supported
• Option: additional Gigabit LAN can be added by USB LAN module
Expansion slots
• 1 x M.2 2230 (for WiFi+BT or Other Module)
• 1 x M.2 2280/2242 (for SATA-6Gb/s or PCIe x4 NVMe)
Storage
• 2 x SATA 6Gb/s
• 1 x M.2 2280/2242 (for SATA-6Gb/s or PCIe x4 NVMe)
Audio
• Realtek® ALC662 6-channel (5.1)
• 2 x 3.5mm Analog Stereo Audio jacks
Back panel I/O
• 4 x USB 3.0 ports
• 1 x Serial COM port
• 1 x HDMI port
• 1 x LAN port
• 2 x 3.5mm Audio jacks
• 1 x DC-In 2.5mm Power Connector
Internal I/O
• 4 x USB 2.0 headers
• 1 x LVDS header
Other I/O
• 1 x MiniDP (Side)
Front panel I/O
Function
System BIOS
• AMI® UEFI / Legacy BIOS
Chassis
• 140D Small Form Factor with aluminum panel, Convertible to 1U Rackmount
• Dimensions: 1.4"(H) x 7"(W) x 7.2"(L) inch, Weight: 3 lb(Net) 10 lb(gross with packaging)
• Cooling: Slim CPU Fan with Heatsink
• Color: Black as default color, option: Gun Grey, Silver, Gold. Other custom color available
• Supports VESA, wall mount or rackmount brackets
• 140D without front USB ports is 7" depth 140D2 with 2 front USB port is 7.5" depth
• Option: 1000 Aluminum Form Factor
• Option: 236F3 Fanless Chassis
Power supply
• Power: DC12V 60W or higher wattage Power Adapter 2.5mm plug (UL/CE/FCC Certified)
• Power Cord: Standard US Power Cord included, European Power Cord available as option
• Energy Star Compliance, Idle mode at <1W
OS support
• Windows 10/11, IoT, Linux
Application
• Set Top Box, Digital Signage, POS/Kiosk, Surveillance, etc.
• Embedded-Longevity
Environment
• Operating Temperature: -5 to +55 C
• Non operating temperature: -20 to +70 C
• Vibration - Operating: 9.8 m/s2(1.0G) 5 to 500Hz
• Vibration - Non operating: 49 m/s2(5.0G) 15 to 500Hz
• Shock - Operating: 3,920 m/s2 (400G) 2ms
• Shock - Non-Operating: 8,820 m/s2 (900G) 1ms
• Operating Relative Humidity: 8% to 90% (non-condensing)
• Non-operating Relative Humidity: 5% to 95% (non-condensing)
• MTBF: 100,000 Hours
• FCC, CE, RoHS Certified
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