Polywell Q870AEL2

Core Ultra Series 2 Arrow Lake-S, 3 x Display HDMI+DP+LVDS/eDP, 3 x M.2, PCIe5.0 x16, vPro

Featured Highlights

• Intel® 15th Gen (Arrow Lake-S) LGA1851 Core™ Processors
• Core Ultra 9/7/5, TDP Max. 65W
• Intel® Q870 Chipset (vPro)
• Intel® Xe LPG Graphics
• 2 x SO-DIMM, DDR5 6400MHz for up to 192GB
• 2 x SATA3.0, 2 x M.2 NVMe/SATA
• 2.5 GbE LAN + 1 GbE LAN, SIM
• PCIe 5.0 x16 Slot, 4 x USB3.2 Gen2
• 7.1 ALC888S Audio Codec
• Power Supply: DC-in 12–26V / 19V Power Adapter (UL/CE/FCC Certified)
• OS Support: Windows 11 64-bit, Linux
• Applications: AI Edge, Digital Signage, Entertainment PC, Audio/Video PC, AI-IoT, High-end Gaming, etc.

CPU options
• Intel® Core™ Ultra Processors (Series 2) (LGA1851)
• Intel® Core™ Ultra 9-285, 7-265, 5-245/235/225 (65W)
• Supports Intel® Hybrid Technology
• Supports Intel® Turbo Boost Max 3.0 Technology
• Supports Intel® Thermal Velocity Boost (TVB)
• Supports Intel® Adaptive Boost Technology (ABT)
• Integrated NPU for dedicated AI acceleration
Chipset
• Intel® Q870 Chipset
Memory
• 2 x SO-DIMM DDR5 6400MHz unbuffered non-ECC Dual Channel I/O
• Supports up to 192GB
Graphics
• Intel® Xe LPG Graphics Architecture
• 1 x HDMI 2.1 port, max. Up to 8K (7680 x 4320) @60 Hz
• 1 x DisplayPort 2.1 max. Up to 8K (7680 x 4320) @60 Hz
• 1 x eDP (Option) max. resolution Up to 5120 x 3200 @60 Hz
• 1 x LVDS max. resolution Up to 1920 x 1200 @60 Hz
Network
• 1 x Intel® I226V 2.5 Gigabit LAN
• 1 x Intel® I219-LM Gigabit (10/100/1000 Mb/s) LAN
• Option: additional Gigabit LAN can be added by USB LAN module
Expansion slots
• 1 x M.2 2230 E Key with CNVi Support (PCIe x1 & USB2.0)
• 1 x M.2 2280 M Key (NVNe with PCIe x4, SATAIII)
• 1 x M.2 2242/3042/3052 B Key (PCIe x1, SATAIII, USB2.0)
• 1 x PCIe5.0 x16
Storage
• 2 x SATAIII 6Gb/s
• 1 x M.2 2280 (for SATA-6Gb/s SSD or PCIe 3.0 x4 NVMe)
• 1 x M.2 2242 (for SATA-6Gb/s SSD )
• Supports SATA RAID 0,1,5,10
Audio
• ALC888S; Nuvoton NCT6126D
• 1 x Speaker 2W 4-pin header with amplifier
• 1 x Audio Header (Front Panel Mic-in & Line-out)
Back panel I/O
• 4 x USB3.2 Gen2
• 1 x HDMI 2.1
• 1 x DisplayPort 2.1
• 2 x RJ45 LAN port
• 1 x Mic-in, 1 x Line-out
Internal I/O
• 1 x LVDS Header, 1 x Backlight Header; 1 x eDP Header (Optional)
• 2 x USB 2.0 (1 x 2.54 pitch header)
• 2 x USB3.2 Gen1 (1 x USB 3.2 header)
• 1 x MiAPI Header (support 10 x GPIO, 1 x SMBUS, 1 x UART, 1 x Watchdog)
• 1 x RS232/422/485 Header & 3 x RS232 Header
• 1 x Front Panel Header; 2 x 4 pin Fan Header; Nano SIM slot
Other I/O
Front panel I/O
Function
System BIOS
• AMI® UEFI BIOS
Chassis
• 140D Small Form Factor with aluminum panel, Convertible to 1U Rackmount
• Dimensions: 7.00"(W) x 7.20"(D) x 1.40"(H), Weight: 3 lb. (Net) 10 lb. (gross with packaging)
• Cooling: Slim CPU Fan with Heatsink
• Color: Black as default color, option: Gun Grey, Silver, Gold. Other custom color available
• Supports VESA/wall mount brackets
• Option: 100F Fanless 1.4" Slim
• Option: 400R with RISER Slot 400S Swap Bay 2x2.5"
• Option: 1750C with slot
Power supply
• Power: DC-in 12–26V / 19V Power Adapter (UL/CE/FCC Certified), DC-in 19V (5.1 mm ID / 7.4 mm OD) / ATX 4-pin 19V,
• Option: DC-in 12–26V (4-pin power connector with 3-pin terminal block cable included in accessories).
• Power Cord: Standard US power cord included, European and other regional Power cords are available as options.
• Energy Star Compliance, Idle mode at <1W
OS support
• Windows 11 64-bit, Linux
Application
• Digital Signage, Entertainment PC, Edge AI, Audio/Video PC, AI-IoT, High-end Gaming, etc.
Environment
• Operating Temperature: -5~-20 to +40~+60 C (Please contact product specialist for details)
• Non operating temperature: -20 to 70 C
• Vibration - Operating: 9.8 m/s2(1.0G) 5 to 500Hz
• Vibration - Non operating: 49 m/s2(5.0G) 15 to 500Hz
• Shock - Operating: 3,920 m/s2 (400G) 2ms
• Shock - Non-Operating: 8,820 m/s2 (900G) 1ms
• Operating Relative Humidity: 8% to 90% (non-condensing)
• Non-operating Relative Humidity: 5% to 95% (non-condensing)
• MTBF: 100,000 Hours
• FCC, CE, RoHS Certified
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