Configure the system

Please, select the below components and indicate the required quantities. All components listed below are compatible with this model.  Keep in mind that there are certain obligatory components which must be selected. Depending on the system you should first look at the:

  • Barebone platform recognizable by short config and CPU in the description. Remember that some models may have several barbones with different CPUs, RAM or storage. You must coose one barebone only. If there will be one barebone only it will be pre-selected as obligatory.
  • If you see no barebone you must first choose the motherboard.
  • If have selected the motherboard you must then choose the CPU.
  • If you are not configuring a barebone you must select the chassis.
  • TBC

H610AL2c

Polywell H610AL2c

1.4” Slim 12th Gen. Socket-S Alder Lake, 3 Display 2 HDMI® 2.1+DP, 3 M.2+2 LAN, 6 USB+2 COM+Type-C

Featured Highlights

• Intel® 12th Gen. Socket-S LGA1700 Core™ i7/i5/i3 Series Processor
• Intel® H610/B760/Q670 Express Chipset
• Intel® 12th Gen, UHD Graphics, 4K/5k/8K Resolution, 2 HDMI® 2.1+DP/VGA
• 2 DDR4 SO-DIMM for up to 64GB Memory
• SATA-6Gb/s, M.2-NVMe/SATA
• 2 Gigabit LAN, M.2-WiFi, Optional M.2-5G/4G-LTE
• 2 USB 3.2, 2 USB 2.0, 2 COM, Type-C
• 7.1 ALC897 Audio Sound
• DC12V/19V 60/90W (UL/CE/FCC Certified)
• OS Support: Windows 11, IoT, Linux
• Applications: POS/Kiosk, Digital Signage, A/V Player, AI Edge, Set Top Box, etc.

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CPU options
• Intel® 12th Generation Comet Lake Processor
• Intel® Core™ i7-12700, 12C/20T 25M 65W
• Intel® Core™ i5-12400 6C/12T 18M 65W
• Intel® Core™ i3-12100, 4C/8T 12M 60W
Chipset
• Intel® H610/B760/Q670 Express Chipset
Memory
• 2 x DDR4 SO-DIMM, up to 64GB
• 3200/2933/2666MHz unbuffered non-ECC (Dual Channel I/O)
Graphics
• Intel® 12th 730 UHD Graphics
• Support 3 Displays
• 1 x DP 1.4, supporting a maximum resolution of 8K 60Hz (can be replaced with VGA port)
• 2 x HDMI® 2.1 ports, supporting a maximum resolution of 4K 60Hz
Network
• 2 x Realtek® RTL8111H Gigabit (10/100/1000 Mb/s) LAN
• 1 x M.2 3052/3042 (for 5G/4G-LTE Module)
• Wake on LAN, PXE boot (Diskless) supported
Expansion slots
• 2 x M.2 2280 (for SATA-6Gb/s or PCIe x4 NVMe)
• 1 x M.2 3052/3042 (for 5G/4G-LTE Module Pair with SIM slot)
Storage
• 2 x M.2 2280 (for SATA-6Gb/s or PCIe x4 NVMe)
Audio
• Realtek® ALC897 8-channel (7.1)
• 2 x 3.5mm Analog Stereo Audio jacks
Back panel I/O
• 2 x USB 2.0 ports
• 1 x DP port
• 2 x HDMI® 2.1 ports
• 2 x LAN ports
• 2 x COM
• 1 x DC-In 2.5mm Power Connector
Internal I/O
Other I/O
Front panel I/O
• 2 x USB 3.2 ports (Front)
• 2 x 3.5mm Audio jacks (Front)
• Type-C USB 3.2 port(Front)
Function
System BIOS
• AMI® UEFI 64MBit / Legacy BIOS
• Watchdog supported
Chassis
• 140E Mini Chassis (Sheet Metal)
• Dimensions: 7.48"(W) x 7.32"(D) x 1.57"(H) / Weight: 2.9 lb (Net) 6.5 lb (Gross).
• VESA, wall mount bracket supported
Power supply
• Power: DC19V 6.32A Power Adapter 2.5mm plug (UL/CE/FCC Certified)
• Power Cord: Standard US Power Cord included, European Power Cord available as option
• Energy Star Compliance, Idle mode at <1W
OS support
• Windows 11, IoT, Linux
Application
• SoHo PC, Thin Client, POS/Kiosk, Digital Signage, A/V Player, AI Edge, Set Top Box, etc.
• Embedded-Longevity
Environment
• Operating Temperature: -5~-20 to +40~+60 C (Please contact product specialist for details)
• Non operating temperature: -20 to 70 C
• Vibration - Operating: 9.8 m/s2(1.0G) 5 to 500Hz
• Vibration - Non operating: 49 m/s2(5.0G) 15 to 500Hz
• Shock - Operating: 3,920 m/s2 (400G) 2ms
• Shock - Non-Operating: 8,820 m/s2 (900G) 1ms
• Operating Relative Humidity: 8% to 90% (non-condensing)
• Non-operating Relative Humidity: 5% to 95% (non-condensing)
• MTBF: 100,000 Hours
• FCC, CE, RoHS Certified
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