Polywell Computers mini PCs in OPS and SDM form factors
In 2010 Intel developed the Open Pluggable Specification (OPS) to simplify the installation, use, maintenance, and upgrade of digital signage (Digital Signage) infrastructure.
This open standard includes the electrical, mechanical, and thermal characteristics of media players and displays connected together through an 80-pin JAE connector that supports, among other things, commonly used interfaces such as DisplayPort and USB. The overall goal is to enable digital signage manufacturers to deploy interchangeable systems faster and in higher volumes, while reducing deployment and implementation costs.
Today’s fast-growing digital signage market is highly fragmented, limiting compatibility and interoperability between current and evolving components such as media players and displays (e.g. LCDs, plasma and other types). The OPS was created to overcome these challenges and save system manufacturers the cost of developing and implementing such a standard themselves.
The OPS specification benefits manufacturers of digital signage systems as well as users. When manufacturers use the OPS specification, their products will be compatible with more installed and future systems, opening up new sales opportunities. Users can easily upgrade their infrastructure because the components will be interchangeable by design.
A further evolution of OPS is Intel’s new specification, SDM (Smart Display Module). Now that digital displays are getting thinner and display installations are becoming more integrated into energy-efficient environmental designs, Intel offers the SDM-S and SDM- L specifications.
They provide the same level of intelligence and interoperability as the OPS, but in a smaller form factor that is suitable for the thinnest integrated displays.
SDM Small, which is nearly one-third the size of the OPS, has no enclosure, so it can accommodate new designs and applications that require minimal space with maximum performance. SDM Large offers a slightly larger form factor – it’s almost the size of an OPS, though it’s thinner. The Intel® SDM Small is only 60mm x 100mm with a maximum thickness of 20mm (depending on the thermal solution chosen) or about the size of a credit card. The Intel® SDM Large is 175 mm x 100 mm.
SDM uses a high-speed PCIe connection that supports multiple generations of Intel® processors.
This connector will also support higher bandwidth and higher resolution displays, and provides built-in I/O that eliminates the need for external I/O.
Polywell Computers manufactures a sufficient lineup of both OPS and SDM devices to meet virtually any customer requirement.
Selection of Polywell Computers mini PCs in OPS and SDM form factors by filter
Here you can select your system based on 32 parameters.
Start with the factor that is most important to you by selecting the appropriate value from the drop-down list. The products will be filtered and a list of systems that meet your first criterion will be provided. You can then specify other factors that are important to you. The first selection will be filtered through the subsequent factors one by one. It will show how many systems meet the criteria you set.
You can start over at any time by pressing either of the two “Reset” buttons.
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