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Polywell Computers mini PCs in OPS and SDM form factors

In 2010 Intel developed the Open Pluggable Specification (OPS) to simplify the installation, use, maintenance, and upgrade of digital signage (Digital Signage) infrastructure.

This open standard includes the electrical, mechanical, and thermal characteristics of media players and displays connected together through an 80-pin JAE connector that supports, among other things, commonly used interfaces such as DisplayPort and USB. The overall goal is to enable digital signage manufacturers to deploy interchangeable systems faster and in higher volumes, while reducing deployment and implementation costs.

Today’s fast-growing digital signage market is highly fragmented, limiting compatibility and interoperability between current and evolving components such as media players and displays (e.g. LCDs, plasma and other types). The OPS was created to overcome these challenges and save system manufacturers the cost of developing and implementing such a standard themselves.

The OPS specification benefits manufacturers of digital signage systems as well as users. When manufacturers use the OPS specification, their products will be compatible with more installed and future systems, opening up new sales opportunities. Users can easily upgrade their infrastructure because the components will be interchangeable by design.

A further evolution of OPS is Intel’s new specification, SDM (Smart Display Module). Now that digital displays are getting thinner and display installations are becoming more integrated into energy-efficient environmental designs, Intel offers the SDM-S and SDM- L specifications.

They provide the same level of intelligence and interoperability as the OPS, but in a smaller form factor that is suitable for the thinnest integrated displays.

SDM Small, which is nearly one-third the size of the OPS, has no enclosure, so it can accommodate new designs and applications that require minimal space with maximum performance. SDM Large offers a slightly larger form factor – it’s almost the size of an OPS, though it’s thinner. The Intel® SDM Small is only 60mm x 100mm with a maximum thickness of 20mm (depending on the thermal solution chosen) or about the size of a credit card. The Intel® SDM Large is 175 mm x 100 mm.

SDM uses a high-speed PCIe connection that supports multiple generations of Intel® processors.

This connector will also support higher bandwidth and higher resolution displays, and provides built-in I/O that eliminates the need for external I/O.

Polywell Computers manufactures a sufficient lineup of both OPS and SDM devices to meet virtually any customer requirement.

Selection of Polywell Computers mini PCs in OPS and SDM form factors by filter

Here you can select your system based on 32 parameters.

Start with the factor that is most important to you by selecting the appropriate value from the drop-down list. The products will be filtered and a list of systems that meet your first criterion will be provided. You can then specify other factors that are important to you. The first selection will be filtered through the subsequent factors one by one. It will show how many systems meet the criteria you set.

You can start over at any time by pressing either of the two “Reset” buttons.

Showing 1–16 of 25 results

  • Mini-PCs

    OPS-H510/Q570

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    11th Gen. Rocket Lake, M.2-WiFi + M.2 SSD/NVMe, 4 USB + Type-C, HDMI+DP Supports vPro®

  • Mini-PCs

    OPS-U11A

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    11th Gen Core™ -u vPro®, Iris® Xe/UHD Graphics Dual 4K Displays, 4USB + Type-C, 3 M.2 + SIM for 4G-LTE

  • Mini-PCs

    SwapPC-H510A

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    Swappable PC 11th Gen. Rocket Lake, UHD 750 Graphics 3 HDMI + DP, 2 M.2 slots, 8 USB + Type-C

  • Mini-PCs

    SwapPC-U11A

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    Swappable PC, 11th Gen. u-Series w/ vPro®, Iris® Xe/UHD Graphics Triple Displays, 8 USB + Type-C

  • Mini-PCs

    OPS-8000

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    8th/10th Gen Core™-u, Iris® 665/UHD Dual 4K Displays, 4USB + Type-C, 3 M.2+SIM for 4G/5G-LTE

  • Mini-PCs

    OPS-U10S

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    10th Gen. u-Series, 2.5″ Swap Bay+M.2, UHD 620 Graphics 4K Display, 4G-LTE SIM+Type-C

  • Mini-PCs

    SwapPC-U10A

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    Swappable PC, 10th Gen. u-Series, UHD Graphics Triple Displays, 8 USB + Type-C

  • Mini-PCs

    SwapPC-U10S

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    Swappable PC 10th Gen. u-Series, 2.5″ Swap Bay+M.2, UHD 620 Graphics 4K Display, 4G-LTE SIM+Type-C

  • Mini-PCs

    OPS-8000-S064

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    8th/9th Gen. Core™-u, Iris® Graphics 4K 2Display, 4 USB + Type-C, 3 M.2 + SIM for 4G-LTE

  • Mini-PCs

    OPS-3865A

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    7th/8th Gen. Celeron®-u, 2x4K Display OPS+HDMI, 4 USB+COM M.2 SSD/NVMe, LAN+M.2 WiFi+SIM for 4G-LTE

  • Mini-PCs

    OPS-7000-S044

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    7th/8th Gen. Core™-u i7/i5/i3, Dual 4K Display OPS+HDMI, M.2 SSD/NVMe+Supports vPro®, 2 MiniPCIe+M.2-WiFi+BT

  • Mini-PCs

    SwapPC-U8A

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    Swappable PC, 8th Gen. u-Series, Iris® Plus 655/UHD 620 Graphics Triple Displays, 8 USB + Type-C

  • Mini-PCs

    SwapPC-U8S

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    Swappable PC 8th Gen. u-Series, 2.5″ Drive Bay+M.2, Iris® Plus 655/UHD 620 Graphics 4K Display, 4G-LTE SIM+Type-C

  • Mini-PCs

    OPS-7000U

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    6th/7th Gen. Core™-u, Dual 4K Display OPS+HDMI/F, 4USB+2COM M.2 SSD/NVMe, M.2+SIM for 3G/4G-LTE

  • Mini-PCs

    SDM-7000L

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    6th/7th Gen. Core™-u, 4 USB+Type-C, M.2 WiFi+2 M.2 SSD/NVMe, 2 DDR4 SO-DIMM up to 32GB

  • Mini-PCs

    OPS-J1900

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    Longevity 4Core Celeron® OPS, Intel® HD Graphics HDMI, Gigabit LAN+MiniPCIe WiFi+BT, 4 USB+COM+mSATA

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